Normal view MARC view ISBD view

Machining of silicon wafers using ultrasonic machining (USM)

Gupta, Shailesh Kumar

Machining of silicon wafers using ultrasonic machining (USM) - India Indian Institute of Technology 2016 - xi, 54p.

Subjects--Personal Names:
Sharma, Apurbha Kumar

Subjects--Facted Index Terms:
Department of Mechanical Engineering

Dewey Class. No.: 621.072 / GUP

Print
Suggest for purchase
Save record
BIBTEX Dublin Core MARCXML MARC (non-Unicode/MARC-8) MARC (Unicode/UTF-8) MARC (Unicode/UTF-8, Standard) MODS (XML) RIS ISBD
More searches

Search for this title in:
Other Libraries (WorldCat) Other Databases (Google Scholar) Online Stores (Bookfinder.com) Open Library (openlibrary.org)