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Joining of dissimilar material (SS-Cu) using diffusion bonding technology

Rajput, Neha

Joining of dissimilar material (SS-Cu) using diffusion bonding technology - India Indian Institute of Technology 2019 - 31p.

Subjects--Personal Names:
Dwivedi, D. K.; Jha, P. K.

Subjects--Facted Index Terms:
Department of Mechanical Engineering

Dewey Class. No.: 621.072 / RAJ

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