Adhesive bonding in photonics assembly and packaging

By: Yacobi, B.G. Hubert, M.(jt.au.)Material type: TextTextPublication details: California American Scientific Publishers 2003Description: xi,173pSubject(s): Optoelectronics | Adhesive BondingDDC classification: 621.381045
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621.381045 Y1A (Browse shelf(Opens below)) 1 Not for loan 307577
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