TY  - BOOK
AU  - Kumar, J.
AU  - Kaushik, B.K. Dasgupta, S.  Thesis Detial  :  M.Tech
TI  - Mixed cnt bundle structure and interconnect analysis
U1  - 621.38072 
PY  - 2013///
CY  - Roorkee
PB  - Department of electronics & communication engineering
ER  -