Kuldeep Kumar <br/><br/>
Development of PCM based packaging material for thermal buffering 

 - India  Indian Institute of Technology Roorkee  2017 
 - viii, 46p. 
<br/><br/><label>Subjects--Personal Names: </label><br/>Chattopadhyay, Sujay
<br/><br/><label>Subjects--Facted Index Terms: </label><br/>Department of Paper Technology
<br/><br/><label>Dewey Class. No.: </label>676.072  / KUL