TY  - BOOK
AU  - Kuldeep Kumar
TI  - Development of PCM based packaging material for thermal buffering
U1  - 676.072 
PY  - 2017///
CY  - India
PB  - Indian Institute of Technology Roorkee
KW  - Chattopadhyay, Sujay
KW  - Department of Paper Technology
ER  -