TY  - BOOK
AU  - Rajput, Neha
TI  - Joining of dissimilar material (SS-Cu) using diffusion bonding technology
U1  - 621.072 
PY  - 2019///
CY  - India
PB  - Indian Institute of Technology
KW  - Dwivedi, D. K.; Jha, P. K.
KW  - Department of Mechanical Engineering
ER  -