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Electronic failure analysis handbook techniques and applications for electronic and electrical packages, components, and assemblies

by Martin, Perry L.

Material type: Text Text Publication details: New York McGraw-Hill 1999Availability: Items available for reference: Not for loan (1) Call number: 621.381046 M39E.

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Electronic packaging materials and processes

by Sartell, J.A. Ed.

Material type: Text Text Publication details: 1986Availability: Items available for loan: 1 Call number: 621.381046 C53E.

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Surface mount technology for concurrent engineering and manufacturing

by Classon, Frank.

Material type: Text Text Publication details: New York McGraw Hill 1993Availability: Items available for loan: 1 Call number: 621.381531 C41S.

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Electronic failure analysis handbook techniques and applications for electronic and electrical packages, components, and assemblies

by Martin, Perry L.

Material type: Text Text Publication details: New York McGraw-Hill 1999Availability: Items available for loan: 1 Call number: 621.381046 M39E.

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Contamination of electronic assemblies

by Pecht, Michael Bumiller, Elissa M. & others.

Material type: Text Text Publication details: London CRC 2002Availability: Items available for loan: 1 Call number: 621.381046 P30C.

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Adhesives technology for electronic applications

by Licari, James J | Swanson, Dale W. jt.au.

Material type: Text Text Publication details: New York William Andrew Publishing 2005Availability: Items available for loan: 1 Call number: 621.381 L57A.

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Microscale heat transfer fundamentals and applications

Material type: Text Text Publication details: Dordrecht Springer 2005Availability: Items available for loan: 1 Call number: 536.2 N77M.

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Complaint structures in nature and engineering

by Jenkins, C.H.M. Ed.

Material type: Text Text Publication details: Southampton Wit Press 2005Availability: Items available for loan: 1 Call number: 620.1123 J39C.

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Handbook of polymer coatings for electronics chemistry,technology and applications

by Licari, James J | Hughes, Laura A. jt.au.

Material type: Text Text Publication details: New York Noyes Publications 1990Availability: Items available for loan: 2 Call number: 621.381046 L57H, ...

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Polymer electronics

by Meng, Hsin-Fei @ed.

Material type: Text Text Publication details: Singapore Pan Stanford 2013Availability: Items available for loan: 1 Call number: 621.381046 M54P.

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Practical guide to the packaging of electronics : thermal and mechanical design and analysis

by Jamnia, Ali.

Edition: 3rdMaterial type: Text Text; Format: print ; Literary form: Not fiction Publication details: Boca Raton CRC Press 2021Availability: Items available for loan: 1 Call number: 621.381046 J25P.

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