Results of search for 'su:"Packaging"' › Mahatma Gandhi Central Library catalog

Results
		No cover image available Electronic failure analysis handbook techniques and applications for electronic and electrical packages, components, and assemblies by Martin, Perry L. Material type: Text Publication details: New York McGraw-Hill 1999Availability: Items available for reference: Not for loan (1) Call number: 621.381046 M39E.
		No cover image available Handbook of package engineering by Hanlon, J.F. Material type: Text Publication details: New York Mcgraw Hill 1971Availability: Items available for loan: 1 Call number: 658.564 H25H. Place hold
		No cover image available Packaging An international survey of package design by Herdeg, Walter Ed. Material type: Text; Format: print ; Nature of contents: Availability: Items available for loan: 1 Call number: 659.12 H57P. Place hold
		No cover image available Electronic packaging materials and processes by Sartell, J.A. Ed. Material type: Text Publication details: 1986Availability: Items available for loan: 1 Call number: 621.381046 C53E. Place hold
		No cover image available Package design engineering by Brown, Kenneth. Material type: Text Publication details: 1959Availability: Items available for loan: 1 Call number: 658.564 B90P. Place hold
		No cover image available Surface mount technology for concurrent engineering and manufacturing by Classon, Frank. Material type: Text Publication details: New York McGraw Hill 1993Availability: Items available for loan: 1 Call number: 621.381531 C41S. Place hold
		No cover image available Electronic failure analysis handbook techniques and applications for electronic and electrical packages, components, and assemblies by Martin, Perry L. Material type: Text Publication details: New York McGraw-Hill 1999Availability: Items available for loan: 1 Call number: 621.381046 M39E. Place hold
		No cover image available Contamination of electronic assemblies by Pecht, Michael Bumiller, Elissa M. & others. Material type: Text Publication details: London CRC 2003Availability: Items available for loan: 1 Call number: 621.381046 P30C. Place hold
		No cover image available Contamination of electronic assemblies by Pecht, Michael Bumiller, Elissa M. & others. Material type: Text Publication details: London CRC 2002Availability: Items available for loan: 1 Call number: 621.381046 P30C. Place hold
		Adhesives technology for electronic applications by Licari, James J \| Swanson, Dale W. jt.au. Material type: Text Publication details: New York William Andrew Publishing 2005Availability: Items available for loan: 1 Call number: 621.381 L57A. Place hold
		Microscale heat transfer fundamentals and applications Material type: Text Publication details: Dordrecht Springer 2005Availability: Items available for loan: 1 Call number: 536.2 N77M. Place hold
		Complaint structures in nature and engineering by Jenkins, C.H.M. Ed. Material type: Text Publication details: Southampton Wit Press 2005Availability: Items available for loan: 1 Call number: 620.1123 J39C. Place hold
		MEMS/MOEMS packaging concepts, designs,materials and processes by Gilleo, Ken. Material type: Text Publication details: New York McGraw-Hill 2005Availability: Items available for loan: 1 Call number: 621.381046 G36M. Place hold
		No cover image available Integrated circuit packaging, assembly and interconnections by Greig, William J. Material type: Text Publication details: New York Springer Science 2007Availability: Items available for loan: 1 Call number: 621.3815 G81I. Place hold
		Handbook of polymer coatings for electronics chemistry,technology and applications by Licari, James J \| Hughes, Laura A. jt.au. Material type: Text Publication details: New York Noyes Publications 1990Availability: Items available for loan: 2 Call number: 621.381046 L57H, ... Place hold
		New packaging design by Noyelle,Gregoire. Material type: Text Publication details: China LST 2010Availability: Items available for loan: 1 Call number: 658.564,N89N. Place hold
		Packaging technology Fundamentals, materials and processes by Emblem, Anne @ed. Material type: Text Publication details: Oxford Woodhead 2012Availability: Items available for loan: 1 Call number: 688.8 E65P. Place hold
		Plastics packaging Properties, processing, applications and regulations by Selke, Susan E. M. Edition: 2ndMaterial type: Text Publication details: Munich Hanser 2004Availability: Items available for loan: 1 Call number: 388.8 S27P. Place hold
		Understanding plastics packaging technology by Selke, Susan E. M. Series: Hanser understanding booksMaterial type: Text Publication details: Munich Hanser 1997Availability: Items available for loan: 1 Call number: 688.8 S27U. Place hold
		Complex packaging Series: Structural package designMaterial type: Text Publication details: Amsterdam The Pepin Press 2010Availability: Items available for loan: 1 Call number: 688.8 S90. Place hold

Refine your search

Availability

Authors

Item types

Locations

Series

Titles

Your search returned 91 results.