| 000 | 00443nam a2200145Ia 4500 | ||
|---|---|---|---|
| 008 | 220709b2019 xxu||||| |||| 00| 0 eng d | ||
| 082 |
_a621.072 _bRAJ |
||
| 100 | _aRajput, Neha | ||
| 245 | _aJoining of dissimilar material (SS-Cu) using diffusion bonding technology | ||
| 260 |
_aIndia _bIndian Institute of Technology _c2019 |
||
| 300 | _a31p. | ||
| 600 | _aDwivedi, D. K.; Jha, P. K. | ||
| 654 | _aDepartment of Mechanical Engineering | ||
| 942 | _cDissertation | ||
| 906 | _a185695 | ||
| 981 | _aIndia: Indian Institute of Technology, Roorkee, 2019. | ||
| 982 | _a31p. | ||
| 983 | _aJoining of dissimilar material (SS-Cu) using diffusion bonding technology | ||
| 999 |
_c161863 _d161863 |
||